High Tg Epoxy Formulation with Good Thermal Properties

ABSTRACT

Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.

This application claims priority to U.S. provisional patent applicationNo. 62/051,051, filed on Sep. 16, 2014, the specification of which isincorporated herein by reference.

BACKGROUND OF THE INVENTION

(1) Field of the Invention

This invention relates to varnish compositions used to make laminatesand prepregs that are then used to manufacture printed circuit boards.This invention also is directed to laminates and prepregs made from thevarnish compositions of this invention. The varnish compositions of thisinvention produce prepregs and laminates that possess excellent thermaland mechanical performance and especially excellent peel strengths.

(2) Description of the Art

There is a laminate phenomenon known as “pad cratering” in which a chipassociated with a printed circuit board laminates can become dislodged.Pad cratering is a mechanically induced fracture in the resin betweencopper foil and outermost layer of fiberglass of a printed circuit boardbut which may be within the resin or at the resin to glass interface.The pad remains connected to the component (usually a Ball Grid Array,BGA) and leaves a “crater” on the surface of the printed circuit board.Pad cratering is believed to be caused by an accumulation of mechanicalstress between the printed circuit board resin and copper. Thus, thereis a need for prepregs and laminates used in printed circuit boards thatreduce the propensity for the circuit boards to suffer from padcratering.

SUMMARY OF THE INVENTION

Laminates and prepregs used in printed circuit boards that have a veryhigh TMA Tg induce less mechanical stress in the circuit boards duringthermal cycling. The reduction of mechanical stress should reduce theincidence of pad cratering. Making high Tg laminates typically requiresthe use of expensive varnish ingredients. The varnishes, prepregs andlaminates of this invention have surprisingly high Tgs and areeconomical to make.

One aspect of this invention are varnishes used to manufacture prepregsand laminates that include a mixture of epoxy resins that unexpectedlyimproves the laminate Tg and thermal properties beyond what would beexpected based upon the varnish ingredient properties. In this inventionaspect, the varnish composition comprises: at least one first epoxyresin and at least one second epoxy resin that is a bisphenol-A novolacepoxy resin and a harder wherein the at least one first epoxy resin andthe at least one second bisphenol-A novolac epoxy resin are present inthe varnish at a weight ratio ranging from about 1.1 to about 1:3 andmore narrowly at a weight ratio of from about 1:1.8 to about 1:2.0.

Another aspect of this invention is a varnish composition comprising:from about 20 wt % to about 50 wt % on an epoxy resin weight basis of amulti-functional epoxy resin; from about 25 wt % to about 60 wt % on anepoxy resin weight basis of an eight-functional bisphenol-A novolacepoxy resin; from about 20 wt % to about 50 wt % on an epoxy resinweight basis of a bifunctional epoxy resin; and a hardener, wherein themulti-functional epoxy resin and the eight functional bisphenol-Anovolac epoxy resin are present in the varnish at a weight ratio rangingfrom about 1:1.8 to about 1:2.0.

Still another aspect of this invention are prepregs and or laminatesmade using one or more prepreg layers of this invention wherein theprepreg comprises a b-staged varnish including at least one first epoxyresin and at least one second epoxy resin that is a bisphenol-A novolacepoxy resin and a harder wherein the at least one first epoxy resin andthe at least one second bisphenol-A novolac epoxy resin are present inthe varnish at a weight ratio ranging from about 1:1 to about 1:3.

Yet another aspect of this invention are prepregs comprising a b-stagedvarnish composition including: from about 20 wt % to about 50 wt % on anepoxy resin weight basis of a multi-functional epoxy resin; from about25 wt % to about 60 wt % on an epoxy resin weight basis of aneight-functional bisphenol-A novolac epoxy resin; from about 20 wt % toabout 50 wt % on an epoxy resin weight basis of a bifunctional epoxyresin; and a hardener, wherein the multi-functional epoxy resin and theeight functional bisphenol-A novolac epoxy resin are present in thevarnish at a weight ratio ranging from about 1:1.8 to about 1:2.0.

In a further aspect, this invention is a varnish composition comprisingan epoxy resin mixture consisting of a combination of three epoxyresins. The varnish composition will further include a hardener andoptionally one or more additional ingredients wherein the combination ofthree epoxy resins consists of from about 20 wt % to about 50 wt % on anepoxy resin weight basis of a multi-functional epoxy resin; from about25 wt % to about 60 wt % on an epoxy resin weight basis of aneight-functional bisphenol-A novolac epoxy resin; from about 20 wt % toabout 50 wt % on an epoxy resin weight basis of a bifunctional epoxyresin; wherein the multi-functional epoxy resin and the eight functionalbisphenol-A novolac epoxy resin are present in the varnish at a weightratio ranging from about 1:1.8 to about 1:2.0.

In the aspects set forth above, the varnish is optionally used toimpregnate a woven fabric material and thereafter the varnish ispartially cured (b-staged) to form a prepreg or it is completely cured(c-staged) to form a laminate.

Prepregs and laminates prepared using the varnishes of this inventionsurprisingly can have a DMA Tg in excess of 280° C. and a T288 in excessof 20 minutes.

DESCRIPTION OF CURRENT EMBODIMENTS

This invention is directed generally to varnishes made from a pluralityof ingredients as well as to prepregs and laminates made using thevarnishes of this invention.

The varnish ingredient amounts are given below as wt % amounts. However,the wt % amounts are given on several different bases. In general, andunless indicated otherwise, the wt % amounts are reporting on a solventfree or “dry” basis. In some instances below, the varnish epoxy resiningredients are reported in wt % based upon the cumulative weight of allepoxy resin ingredients. This is referred to as wt % on an “epoxy resinweight basis”. In other instances, varnish ingredient weight percent'sare reported based upon the total varnish or laminate weight (on a drybasis) and includes the weight of all varnish ingredients including, forexample, fillers, flame retardants and so forth—but not including anycore materials such as woven glass, felt or ground up fiber materials.This weight percent is referred to below as wt % on a “total laminateweight basis”.

Varnishes of this invention are made by a “compounding” process where aresin ingredient is combined with other ingredients to form athermosettable varnish. The varnish is then used to manufacture alaminate. The varnish can be used to manufacture a laminate by“impregnating” a core material such as a woven glass fabric with thevarnish. Alternatively, the varnish can be used to coat a copper sheetto form a resin coated copper sheet or laminate or the varnish can beused to form a laminate sheet that does not have a core material. Thelaminates made from the varnishes of this invention are useful as aprepreg—i.e., partially cured or “b-stage” form—and in a completelycured “c-stage” form. The ingredients used to formulate the varnishes ofthis invention are discussed in more detail below. Unless statedotherwise, the composition ingredient weight percent ranges and varnishingredient weight percent ranges are reported on a dry or solvent freebasis.

The varnishes of this invention may include mixtures of epoxy resinshaving different functionalities. The term “multi-functional epoxy”refers to an epoxy resin having 3 or more oxirane groups per moleculeand more preferably from 3 up to about 8 oxirane groups per molecule.The term “bi-functional epoxy resin” refers to an epoxy resin having twooxirane groups per molecule.

The varnishes of the invention include at least one epoxy resin and atleast one bisphenol-A novolac epoxy resin wherein the at least one epoxyresin and at least one bisphenol-A novolac epoxy resin are present inthe varnish at a weight ratio ranging from about 1:2.5 to about 1:1. Theterm “bisphenol-A novolac epoxy resin” refers to generally to epoxyresins that have the following formula:

During resin manufacture, there can be some variation in the formula ofthe resins that are contained in the resin. For example the bisphenol-Anovolac epoxy resin above will be predominantly monomers having8-functional groups but due to manufacturing variability the resin willinclude some monomers with seven functional groups, six functionalgroups and so forth. In addition, some of the monomers can include 3 or5 of the repeating groups instead of the four shown in the formulaabove. By “predominantly” it is meant that at least 80% and preferablyat least 90% and more preferable at least 95% of the monomers ofbisphenol-A novolac epoxy resin will have the four repeating groups andinclude 8-functional groups as shown in the formula above.

In another aspect of this invention, other epoxy resins used in thevarnishes for manufacturing prepregs and laminates will also bepredominantly monomers having the same formula where the term“predominantly” has the same definition as set forth above.

In another embodiment, the varnishes of this invention will include afirst epoxy resin that is preferably a multi-functional epoxy, a secondbisphenol-A novolac epoxy resin and a third epoxy resin. In thisembodiment, the third epoxy resin may be mono-functional, bi-functionalor multi-functional with a bi-functional epoxy resin being preferred. Inall embodiments, the second bisphenol-A novolac epoxy resin may bemonofunctional, bi-functional or multi-functional. In a preferredaspect, the second bisphenol-A novolac epoxy resin will bemulti-functional epoxy and preferably it will have 8 oxirane groups permolecule.

In general, the first epoxy resin will be present in the varnish in anamount ranging from about 20 to about 60 wt % based upon the weight ofall epoxy ingredients weight—“epoxy resin weight basis”. If the varnishincludes a first epoxy resin and a third epoxy resin, the first andthird epoxy resins will each be present in the varnish in an amountranging from about 30 to about 65 wt % on an epoxy resin weight basisand the second epoxy resin, the bisphenol-A novolac epoxy resin, will bepresent in the varnish in an amount ranging from about 25 to about 60 wt% on an epoxy resin weight basis. In one embodiment, when a first epoxyresin and second epoxy resin are used together in the formulation thenthey will be present together in an amount ranging from about 40 toabout 75 wt % on an epoxy resin weight basis.

The resin compositions of this invention will further include a hardenerthat reacts with the epoxy groups to harden or cross-link the discreteepoxy resin molecules. In one embodiment, the hardener is an aromaticamine. Some preferred aromatic amine hardeners include 4,4′DDS—4,4′-diaminodiphenylsulfone, 3,3′ DDS—3,3′-diaminodiphenylsulfoneand mixtures thereof. The one or more aromatic amine hardeners willtypically be present in the varnish of this invention in an amountranging from about 2.0 to about 25 wt % on a total laminate weightbasis—including fillers.

Flame Retardants

The compounded varnishes of this invention may include one or more flameretardants. Any flame retardant that is known to be useful in resincompositions used to manufacture composites and laminates use tomanufacture printed circuit boards may be used. The flame retardants maycontain halogens or they may be halogen free. Examples of useful flameretardants include, but are not limited to, halides of glycidyletherified bifunctional alcohols, halides of novolac resins such asbisphenol A, bisphenol F, polyvinylphenol or phenol, creosol,alkylphenol, catecohl, and novolac resins such as bisphenol F, inorganicflame retardants such as antimony trioxide, red phosphorus, zirconiumhydroxide, barium metaborate, aluminum hydroxide, and magnesiumhydroxide, and phosphor flame retardants such as tetraphenyl phosphine,tricresyl-diphenyl phosphate, triethylphosphate,cresyldiphenylphosphate, xylenyl-diphenyl phosphate, acid phosphateesters, ammonia phosphate, ammonia polyphosphate, ammonia cyanurate,phosphate compounds containing nitrogen, and phosphate esters containinghalides.

The phosphor flame retardants may include, for example those disclosedin U.S. Pat. Nos. 6,645,631, 7,687,556 and 8,129,456 the specificationsof each of which is incorporated herein by reference.

Flame retardants will be present in the resin compositions of thisinvention in an amount sufficient to allow laminates made from the resincompositions to pass the UL-94 flammability test.

In one preferred embodiment, the flame retardant is the solid flameretardant decabromodiphenylethane, which has the following structure:

Decabromodiphenylethane is commercially available, for example, fromAlbemarle Corporation (451 Florida St., Baton Rouge, La. 70801). TheAlbemarle product is sold as Saytex™ 8010. Another useful high brominecontent insoluble flame retardant is ethylenebistetrabromophthalimidewhich is sold as Saytex BT93W by Albemarle Corporation. Other similaruseful flame retardants include decabromodiphenyl oxide and brominatedpolystyrene.

A flame retardants or combinations thereof may be present in the varnishin an amount ranging from about 5% to about 50%, or from about 5% toabout 20% on a total dry laminate weight basis.

Initiators/Catalysts

The varnishes of this invention may include initiators or catalysts thatpromote varnish cross-linking typically when the varnish is heated.Useful initiators/catalysts are Lewis acids such as BF₃-MEA.

The amount of initiator used depends upon its application. When used ina varnish, the initiator will be present in an amount ranging from about0.5 to about 3.0 wt % on a total laminate weight basis.

In another embodiment, the varnishes of the invention will generallyhave the following ingredients in the recited amounts where the amountsare reported in parts by weight on a total laminate weight basis.

Varnish Formula Varnish Ingredient (parts by weight) Flame retardant -10-70 Optional filler  0-50 Glicydyl ether of a bisphenol A  80-150novolac (epoxy) Multifunctional epoxy 30-60 Bi-functional epoxy 30-60Hardener 20-50 Optional rubber 0-5 Optional Lewis acid 0-5

In an alternative embodiment, the varnishes of the invention willgenerally have the following ingredients in the recited amounts wherethe amounts are reported in parts by weight on a total laminate weightbasis.

Component Varnish Formula - Name Varnish Ingredient parts by weightSaytex 8010 Brominated flame retardant - 40-60 decabromodiphenylethaneMegasil 525 Crystalline silica filler  0-50 XZ 92757 X75 Glicydyl etherof a bisphenol A  85-135 novolac (8-functional group epoxy) Epon 1031A70 Multifunctional epoxy 30-60 DER 838 B90 Bi-functional epoxy 30-604,4′DDS Aromatic amine hardener 20-50 Nipol rubber Rubber 0-5 BF₃—MEALewis Acid 0-5

Solvents

One or more solvents are typically incorporated into the varnishcompositions of this invention in order to solubilize the appropriatevarnish composition ingredients, and or to control varnish viscosity,and/or in order to maintain the ingredients in a suspended dispersion.Any solvent known by one of skill in the art to be useful in conjunctionwith thermosetting resin systems can be used. Particularly usefulsolvents include methylethylketone (MEK), toluene, dimethylformamide(DMF), or mixtures thereof.

When used, solvents are present in the varnish in an amount of fromabout 20% to about 50% as a weight percentage of the total weight of thecomposition.

Optional Ingredients

(a) Fillers

One or more fillers can optionally be added to the resin compositions ofthis invention to improve chemical and electrical properties of thecured resin. Examples of properties that can be modified with fillersinclude, but are not limited to, coefficient of thermal expansion,increasing modulus, and reducing prepreg tack. Non-limiting examples ofuseful fillers include particulate forms of Teflon®, Rayton®, talc,quartz, ceramics, particulate metal oxides in amorphous or crystallineform such as silica, titanium dioxide, alumina, ceria, clay, boronnitride, wollastonite, particulate rubber, PPO/PolyPhenylene Oxide andmixtures thereof. Other examples of useful fillers include calcinedclay, fused silica and combinations thereof. Yet other useful fillersare silane treated silica and reclassified silica. When used, fillersare present in the compounded varnish of this invention in an amountfrom greater than 0% to about 40 wt %, preferably from greater than 0 toabout 20 wt %, based on 100% by weight solids of the composition.

(b) Tougheners

The thermosetting resin compositions of this invention may include oneor more tougheners. The tougheners are added to the resin compositionsto improve the drillability of the resulting composites and laminates.Useful tougheners include methyl methacrylate/butadiene/styrenecopolymer, methacrylate butadiene styrene core shell particles, carboxylterminated butyl nitride, amino terminated butyl nitride and mixturesthereof. When used, tougheners are present in the thermosetting resincompositions of this invention in an amount from about 1% to about 5%,preferably from about 2 to about 4%, based on 100% by weight solids ofthe laminate.

(c) Other Optional Ingredients

Optionally, the compounded varnish may also contain other additives suchas defoaming agents, leveling agents, dyes, and pigments. For example, afluorescent dye can be added to the resin composition in a trace amountto cause a laminate prepared therefrom to fluoresce when exposed to UVlight in a board shop's optical inspection equipment. A usefulfluorescent dye is a highly conjugated diene dye. One example of such adye is 2,5-thiophenediylbis(5-tert-butyl-1,3-benzoxazole.

Other optional ingredients known by persons of skill in the art to beuseful in resins that are used to manufacture printed circuit boardlaminates may also be included in the resin compositions of thisinvention.

Prepregs and Laminates

The varnishes described above are useful for preparing prepregs and/orlaminates used in the manufacture of printed circuit boards. In order tobe useful in manufacturing printed circuit boards the laminates can bepartially cured or b-staged in which state they can be laid up withadditional material sheets to form a c-staged or fully cured laminatesheet. Alternatively, the resins can be manufactured into c-staged orfully cured material sheets.

In one useful processing system, the resin compositions of thisinvention are useful for making prepregs in a batch or in a continuousprocess. Prepregs are generally manufactured using a core material suchas a roll of woven glass web (fabric) which is unwound into a series ofdrive rolls. The web then passes into a coating area where the web ispassed through a tank which contains the thermosetting resin system ofthis invention, solvent and other components where the glass web becomessaturated with the resin. The saturated glass web is then passed througha pair of metering rolls which remove excess resin from the saturatedglass web and thereafter, the resin coated web travels the length of adrying tower for a selected period of time until the solvent isevaporated from the web. A second and subsequent coating of resin can beapplied to the web by repeating these steps until the preparation of theprepreg is complete whereupon the prepreg is wound onto roll The wovenglass web can replaced with a woven fabric material, paper, plasticsheets, felt, and/or particulate materials such as glass fiber particlesor particulate materials.

In another process for manufacturing prepreg or laminate materials,thermosetting resins of this invention are premixed in a mixing vesselunder ambient temperature and pressure. The viscosity of the pre-mix is˜100-500 cps and can be adjusted by adding or removing solvent from theresin. Fabric substrate (typically but not limited to E glass) is pulledthrough a dip tank including the premixed resin, through an oven towerwhere excess solvent is driven off and the prepreg is rolled or sheetedto size, layed up between Cu foil in various constructions depending onglass weave style, resin content & thickness requirements.

The thermosetting resin (varnish) mix can also be applied in a thinlayer to a Cu foil substrate (RCC—resin coated Cu) using slot-die orother related coating techniques.

The varnishes, prepregs and resin coated copper foil sheets describedabove can be used to make laminates in batch or in continuous processes.In exemplary continuous process for manufacturing laminates of thisinvention, a continuous sheet in the form of each of copper, a resinprepreg and a thin fabric sheet are continuously unwound into a seriesof drive rolls to form a layered web of fabric, adjacent to the resinprepreg sheet which is adjacent to a copper foil sheet such that theprepreg sheet lies between the copper foil sheet and the fabric sheetThe web is then subjected to heat and pressure conditions for a timethat is sufficient to cause the resin to migrate into the fabricmaterial and to completely cure the resin. In the resulting laminate,the migration of the resin material into the fabric causes the thicknessof the resin layer (the distance between the copper foil material andthe fabric sheet material to diminish and approach zero as combinationlayers discussed above transforms from a web of three layers into asingle laminate sheet. In an alternative to this method, a singleprepreg resin sheet can be applied to one side of the fabric materiallayer and the combination sandwiched between two copper layers afterwhich heat and/or pressure is applied to the layup to cause the resinmaterial to flow and thoroughly impregnate the fabric layer and causeboth copper foil layers to adhere to the central laminate.

In still another embodiment, the resin coated copper sheets can be madeat the same time the laminate is being made by applying a thin coatingof resin to two different continuously moving copper sheets, removingany excess resin from the sheets to control the resin thickness and thenpartially curing the resin under heat and/or pressure conditions to forma sheet of b-staged resin coated copper. The sheet(s) of b-staged resincoated copper can then be used directly in the laminate manufacturingprocess.

In yet another embodiment, the fabric material—with or without priorpretreatment—can be continuously fed into a resin bath such that thefabric material becomes impregnated with the resin. The resin can beoptionally partially cured at this stage in the process. Next, one ortwo copper foil layers can be associated with the first and/or secondplanar surface of the resin impregnated fabric sheet to form a web afterwhich heat and/or pressure is applied to the web to fully cure theresin.

Example I

A varnish having the following formulation was combined with 15-45 partsof dimethylformamide (DMF) solvent.

TABLE 1 Component Varnish Formula - Name parts (wt %) Saytex 8010Brominated Flame retardant - 36 (18.1%) decabromodiphenylethane Megasil525 Crystalline silica filler 39 (7.3)    XZ 92757 X75 Glicydyl ether ofa bisphenol A 105 (33.3%)  novolac (having 8 functional groups) Epon1031 A70 Multifunctional epoxy (tetra- 45 (14.3%) functional) DER 383B90 Bi-functional epoxy 45 (14.3%) 4,4′DDS Aromatic amine 36 (11.4%)Nipol rubber Rubber 1.9 (0.6%)  BF₃—MEA Lewis Acid 2.4 (0.7%)  Totals315.1 (100%)   

The varnish was used to impregnate a woven sheet of “e” glass. However,alternatives to e glass such as “s” glass or “low Dk” “quartz” wovenand/or matte glass cloth can be used.

The impregnation was performed manually. The woven glass cloth wasdipped in the varnish for a period of time ranging from about 5 secondsto about 60 seconds then the solvents were driven off in a forced airoven for 1 to 5 minutes operating at between 300° F. and 400° F. Thevarnish impregnated woven glass cloth was then removed from the varnishand cured under pressure (50-400 psi) and held at 350° F.-450° F. for aminimum of 30 minutes and a maximum of 180 minutes to form a fully curedlaminate. The properties of the fully cured laminate are reported below:

TABLE 2 Test Result TMA CTE 245° C. (2.1% exp) DMA (Tg) >280° C. DSC(Tg) >235° C. T260 >60 min T288 20 min Solder Float 1000 s Peelscondition “B” 1/2 TWS/B 6.7/4.3 Total Burn/Longest Burn 5/3

An alternative varnish formulation used to form a laminate is set forthin Table 3 below. The properties of the laminate produced with thealternative varnish formulation are similar to those reported above.

TABLE 3 Varnish Total Wt. Component including Laminate Name ChemicalName solvent Solids Wt. DMF Polar Solvent 46 (12.47) — Saytex 8010Brominated Flame 57 (15.45)  57 (20.89) retardant - decabromodi-phenylethane Megasil 525 Crystalline silica filler 23 (6.23)   23 (8.43)(optional) XZ 92757 X75 Glicydyl ether of a 105 (28.46)  78.75 (28.86) bisphenol A novolac having eight functional groups Epon 1031 A70Multifunctional epoxy 45 (12.20) 31.5 (11.54) DER 838 B90 Bi-functionalepoxy 45 (12.20) 40.5 (14.84) 4,4′DDS Aromatic amine 36 (9.76)   36(13.19) Nipol Rubber (optional) 7.7 (2.09)  1.93 (0.71)  1472X-P25BYK-310 Surfactant (optional) 1.8 (0.49)  1.8 (0.66) BF3—MEA Lewis Acid2.4 (0.65)  2.4 (0.88) Totals 368.9 272.9

Example 2

The following varnishes A-H were prepared according to Table 4 below:

TABLE 4 A B C D E F G H Component (parts) (parts) (parts) (parts)(parts) (parts) (parts) (parts) Bi- 41.6 38 54 29.2 300 112.1 61.8Functional DER DER DER DER DER DER DER3 Epoxy Glycidyl Ether Epoxy 14.131.7 218.3 40.2 XZ9 XZ9 XZ9 XZ9 Hardener 100 100 30.3 39.9 100 100 100100 BENA BENA BENB BENB DDS DDS BENB BENB Hardener 100 100 SMA SMA InTable 4; SMA = styrene maleic anhydride; BENA = benzoxazine based uponphenolphthalein; BENB = benzoxazine based upon bisphenol-A; DDS =4,4′-diaminodiphenylsulfone; DER = DER383 a bifunctional epoxy resin;XZ9 = XZ92757 - an 8 functional glycidyl ether epoxy resin.

The ingredients of varnishes A-H above were combined with the solventDMF and a Lewis acid (BF₃-MEA) to form a thermosetting varnish. Eachvarnish was used to impregnate a woven sheet of “e” glass. Theimpregnation was performed manually. The woven glass cloth was dipped inthe varnish for a period of time ranging from about 5 seconds to about60 seconds then the solvents were driven off in a forced air oven for 1to 5 minutes operating at between 300° F. and 400° F. The varnishimpregnated woven glass cloth was then removed from the varnish andcured under pressure (50-400 psi) and held at 350° F.-450° F. for aminimum of 30 minutes and a maximum of 180 minutes to form a fully curedlaminate.

Table 5 below compares some physical properties of the laminates madeusing each varnish.

TABLE 5 Property A B C D E F G H DSC (° C.) 200 192 DMA (° C.) 220 210195 193 237 302 T288 (min) 9 20 TMA (° C.) 209 252 159 192 T260 (min) 6026 In Table 5, DMA = Dynamic mechanical analysis of Tg. T288 = Time todelamination at 288° C. T260 = Time to delamination at 260° C. TMA =Thermal mechanical analysis. DSC = Differential scanning calorimetry.

The physical properties of the laminates made with varnishes A-H arecompared side-by-side in Table 6 below.

TABLE 6 Varnish Comparison TMA DMA DSC T288 A/B No effect No effect Noeffect No effect C/D No effect −20 C. −30 C. +20 min E/F +47 C. +60 C.+36 C. +20 min G/H +40 C. +50 C. +50 C. −30 min

The c-staged laminate physical property results reported in Table 6demonstrate that there is an unexpected weight combination of the bi-and/or multi-functional epoxy resin ingredient and glycidyl ether ofbisphenol A novolac ingredient that, when combined to form a varnishused to manufacture an electrical laminate material produces laminateswith unexpectedly high Tg's (DMA Tg and DSC Tg), good T288 times (timeto delamination) and TMA results. The Tg results are important becauselaminate expansion accelerates as the laminate temperature approachesthe laminate Tg. Therefore, the higher the laminate Tg, the more heatthe laminate can endure without exhibiting unwanted expansion that candamage printed circuit board electrical components and connections. Oneor more of these favorable results tends to degrade according to Table 6as the amount of either epoxy ingredient in the varnish approaches 0parts.

The foregoing description of the specific embodiments will reveal thegeneral nature of the disclosure so others can, by applying currentknowledge, readily modify and/or adapt for various applications suchspecific embodiments without departing from the generic concept, andtherefore such adaptations and modifications are intended to becomprehended within the meaning and range of equivalents of thedisclosed embodiments. It is to be understood that the phraseology orterminology herein is for the purpose of description and not oflimitation.

1-20. (canceled)
 21. The prepreg of claim 41 wherein the at least onefirst epoxy resin and the at least one second bisphenol-A novolac epoxyresin are present in the varnish at a weight ratio ranging from about1:1.8 to about 1:2.0. 22-31. (canceled)
 32. The prepreg of claim 41wherein the hardener is 4,4′-diaminophenylsulfone. 33-36. (canceled) 37.The prepreg of claim 41 wherein the at least one flame retardant isdecabromodiphenylethane. 38-39. (canceled)
 40. A printed circuit boardincluding at least one layer that a c-staged prepreg of claim
 41. 41. Aprepreg comprising a b-staged varnish composition including: 30-60 partsby weight of an epoxy resin weight basis of a multi-functional epoxyresin; 80-150 parts by weight of an eight-functional bisphenol-A novolacepoxy resin; 30-60 parts by weight of a bifunctional epoxy resin; 20-50parts by weight of a hardener selected from 4,4′-diaminodiphenylsulfone,3,3′-diaminodiphenylsulfone and mixtures thereof; and 10-70 parts byweight of a flame retardant.
 42. A prepreg consisting essentially of ab-staged varnish composition including: 30-60 parts by weight of anepoxy resin weight basis of a multi-functional epoxy resin; 80-150 partsby weight of an eight-functional bisphenol-A novolac epoxy resin; 30-60parts by weight of a bifunctional epoxy resin; 20-50 parts by weight ofa hardener selected from 4,4′-diaminodiphenylsulfone,3,3′-diaminodiphenylsulfone and mixtures thereof; 10-70 parts by weightof a flame retardant; 0-50 parts of a filler; 0-5 parts of a rubber; and0-5 parts of a Lewis acid.